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| Part Number | AT28HC256F-90DM/883 | AT28HC256F-90FM/883 | AT28HC256F-90LM/883 | AT28HC256F-90UM/883 | AT28HC256-90DM/883 | AT28HC256E-90DM/883 |
|---|---|---|---|---|---|---|
| Manufacturer | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Product Status | Active | Active | Active | Active | Active | Active |
| Memory Type | Non-Volatile | Non-Volatile | Non-Volatile | Non-Volatile | Non-Volatile | Non-Volatile |
| Memory Format | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
| Technology | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
| Memory Size | 256Kb (32K x 8) | 256Kb (32K x 8) | 256Kb (32K x 8) | 256Kb (32K x 8) | 256Kb (32K x 8) | 256Kb (32K x 8) |
| Memory Interface | Parallel | Parallel | Parallel | Parallel | Parallel | Parallel |
| Clock Frequency | - | - | - | - | - | - |
| Write Cycle Time - Word, Page | 3ms | 3ms | 3ms | 3ms | 10ms | 10ms |
| Access Time | 90 ns | 90 ns | 90 ns | 90 ns | 90 ns | 90 ns |
| Voltage - Supply | 4.5V ~ 5.5V | 4.5V ~ 5.5V | 4.5V ~ 5.5V | 4.5V ~ 5.5V | 4.5V ~ 5.5V | 4.5V ~ 5.5V |
| Operating Temperature | -55°C ~ 125°C (TC) | -55°C ~ 125°C (TC) | -55°C ~ 125°C (TC) | -55°C ~ 125°C (TC) | -55°C ~ 125°C (TC) | -55°C ~ 125°C (TC) |
| Mounting Type | Through Hole | Surface Mount | Surface Mount | Through Hole | Through Hole | Through Hole |
| Package / Case | 28-CDIP (0.600", 15.24mm) | 28-CFlatPack | 32-CLCC | 28-BCPGA | 28-CDIP (0.600", 15.24mm) | 28-CDIP (0.600", 15.24mm) |
| Supplier Device Package | 28-CERDIP | 28-FlatPack, Ceramic Bottom-Brazed | 32-LCC (11.43x13.97) | 28-CPGA (13.97x16.51) | 28-CERDIP | 28-CERDIP |
