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| Part Number | AT28HC256F-12FM/883 | AT28HC256F-12LM/883 | AT28HC256F-12UM/883 | AT28HC256E-12FM/883 | AT28HC256F-12DM/883 | 
|---|---|---|---|---|---|
| Manufacturer | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | 
| Product Status | Active | Active | Active | Active | Active | 
| Memory Type | Non-Volatile | Non-Volatile | Non-Volatile | Non-Volatile | Non-Volatile | 
| Memory Format | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | 
| Technology | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | 
| Memory Size | 256Kb (32K x 8) | 256Kb (32K x 8) | 256Kb (32K x 8) | 256Kb (32K x 8) | 256Kb (32K x 8) | 
| Memory Interface | Parallel | Parallel | Parallel | Parallel | Parallel | 
| Clock Frequency | - | - | - | - | - | 
| Write Cycle Time - Word, Page | 3ms | 3ms | 3ms | 10ms | 3ms | 
| Access Time | 120 ns | 120 ns | 120 ns | 120 ns | 120 ns | 
| Voltage - Supply | 4.5V ~ 5.5V | 4.5V ~ 5.5V | 4.5V ~ 5.5V | 4.5V ~ 5.5V | 4.5V ~ 5.5V | 
| Operating Temperature | -55°C ~ 125°C (TC) | -55°C ~ 125°C (TC) | -55°C ~ 125°C (TC) | -55°C ~ 125°C (TC) | -55°C ~ 125°C (TC) | 
| Mounting Type | Surface Mount | Surface Mount | Through Hole | Surface Mount | Through Hole | 
| Package / Case | 28-CFlatPack | 32-CLCC | 28-BCPGA | 28-CFlatPack | 28-CDIP (0.600", 15.24mm) | 
| Supplier Device Package | 28-FlatPack, Ceramic Bottom-Brazed | 32-LCC (11.43x13.97) | 28-CPGA (13.97x16.51) | 28-FlatPack, Ceramic Bottom-Brazed | 28-CERDIP |