MB89935BPFV-G-361-ERE1
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Infineon Technologies MB89935BPFV-G-361-ERE1

Manufacturer No:
MB89935BPFV-G-361-ERE1
Manufacturer:
Infineon Technologies
Package:
Tape & Reel (TR)
Datasheet:
MB89935BPFV-G-361-ERE1 Datasheet
ECAD Model:
-
Description:
IC MCU 8BIT 16KB MROM 30SSOP
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Attributes

Core Processor:F²MC-8L
Core Size:8-Bit
Speed:10MHz
Connectivity:Serial I/O, UART/USART
Peripherals:POR, PWM, WDT
Number of I/O:21
Program Memory Size:16KB (16K x 8)
Program Memory Type:Mask ROM
EEPROM Size:- 
RAM Size:512 x 8
Voltage - Supply (Vcc/Vdd):2.2V ~ 5.5V
Data Converters:A/D 8x10b
Oscillator Type:External
Operating Temperature:-40°C ~ 85°C (TA)
Mounting Type:Surface Mount
Package / Case:30-LSSOP (0.220", 5.60mm Width)
Supplier Device Package:30-SSOP
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Similar Products

Part Number MB89935BPFV-G-361-ERE1 MB89935BPFV-G-368-ERE1  
Manufacturer Infineon Technologies Infineon Technologies
Product Status Obsolete Obsolete
Core Processor F²MC-8L F²MC-8L
Core Size 8-Bit 8-Bit
Speed 10MHz 10MHz
Connectivity Serial I/O, UART/USART Serial I/O, UART/USART
Peripherals POR, PWM, WDT POR, PWM, WDT
Number of I/O 21 21
Program Memory Size 16KB (16K x 8) 16KB (16K x 8)
Program Memory Type Mask ROM Mask ROM
EEPROM Size - -
RAM Size 512 x 8 512 x 8
Voltage - Supply (Vcc/Vdd) 2.2V ~ 5.5V 2.2V ~ 5.5V
Data Converters A/D 8x10b A/D 8x10b
Oscillator Type External External
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Mounting Type Surface Mount Surface Mount
Package / Case 30-LSSOP (0.220", 5.60mm Width) 30-LSSOP (0.220", 5.60mm Width)
Supplier Device Package 30-SSOP 30-SSOP

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