MB89636RPF-G-611-BNDE1
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Infineon Technologies MB89636RPF-G-611-BNDE1

Manufacturer No:
MB89636RPF-G-611-BNDE1
Manufacturer:
Infineon Technologies
Package:
Tray
Datasheet:
MB89636RPF-G-611-BNDE1 Datasheet
ECAD Model:
-
Description:
IC MCU 8BIT 24KB MROM 64QFP
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Attributes

Core Processor:F²MC-8L
Core Size:8-Bit
Speed:10MHz
Connectivity:EBI/EMI, Serial I/O, UART/USART
Peripherals:POR, PWM, WDT
Number of I/O:53
Program Memory Size:24KB (24K x 8)
Program Memory Type:Mask ROM
EEPROM Size:- 
RAM Size:768 x 8
Voltage - Supply (Vcc/Vdd):2.2V ~ 6V
Data Converters:A/D 8x10b
Oscillator Type:External
Operating Temperature:-40°C ~ 85°C (TA)
Mounting Type:Surface Mount
Package / Case:64-BQFP
Supplier Device Package:64-QFP (14x20)
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Similar Products

Part Number MB89636RPF-G-611-BNDE1 MB89636RPF-G-617-BNDE1  
Manufacturer Infineon Technologies Infineon Technologies
Product Status Obsolete Obsolete
Core Processor F²MC-8L F²MC-8L
Core Size 8-Bit 8-Bit
Speed 10MHz 10MHz
Connectivity EBI/EMI, Serial I/O, UART/USART EBI/EMI, Serial I/O, UART/USART
Peripherals POR, PWM, WDT POR, PWM, WDT
Number of I/O 53 53
Program Memory Size 24KB (24K x 8) 24KB (24K x 8)
Program Memory Type Mask ROM Mask ROM
EEPROM Size - -
RAM Size 768 x 8 768 x 8
Voltage - Supply (Vcc/Vdd) 2.2V ~ 6V 2.2V ~ 6V
Data Converters A/D 8x10b A/D 8x10b
Oscillator Type External External
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Mounting Type Surface Mount Surface Mount
Package / Case 64-BQFP 64-BQFP
Supplier Device Package 64-QFP (14x20) 64-QFP (14x20)

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